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TLV320AIC12K ground planes

Other Parts Discussed in Thread: TLV320AIC12K

Hi,

I'm working on an old design with the TLV320AIC12K CODEC, and am trying to figure out how the thermal pad on the QFN (RHB) package should be connected because on our old design the connection appears strange... Indeed on our old design, but anyone can tell me why, we have an audio ground plane, a digital ground plane and the thermal pad of the TLV that is separated (see file attached). Is there any application note that specify this separation ?

Where connect the AVSS pin ? To the thermal pad as DRVSS pin ? How we should do the separation between analogic and digital plane ?

We have bought a long time ago EVM board of TLV320AIC12k but we haven't any information on the Layout used in order to compare... Is there any aplication note that help concerning the routing of these components ?
 We have surprise to don't find any information concerning this point.

Thanks in advance, Best regards

  • Hi,

    The thermal pad on the 12K is isolated electrically. It is usually tied to the analog ground plane but can be tied elsewhere so long and there isn't too much noise that could capacitivley couple to the chip. The analog and digital grounds must be tied together somewhere close to the chip.

    Best Regards,

    dave 

  • Thanks for your quick answer !

    In the datasheet it's recommanded to connect the thermal pad to pin DRVSS. why this one and not the AVSS  Pin?

    In this case how connect AVSS ans DRVSS pin otherwise that by the thermal pad? 

  • Hi, Axel,

    The DRVSS pin (Ground driver) should be connected to the thermal pad because the gate driver of the output amplifier generates a little bit of heat (16Ohm)..

    The AVSS and DRVSS can be connected by the thermal pad as you typically made in the picture, this is how it should be.

    Regards,

    --------------------

    Mohamed Hellal

    Audio Applications