Hi,
I'm working on an old design with the TLV320AIC12K CODEC, and am trying to figure out how the thermal pad on the QFN (RHB) package should be connected because on our old design the connection appears strange... Indeed on our old design, but anyone can tell me why, we have an audio ground plane, a digital ground plane and the thermal pad of the TLV that is separated (see file attached). Is there any application note that specify this separation ?
Where connect the AVSS pin ? To the thermal pad as DRVSS pin ? How we should do the separation between analogic and digital plane ?
We have bought a long time ago EVM board of TLV320AIC12k but we haven't any information on the Layout used in order to compare... Is there any aplication note that help concerning the routing of these components ?
We have surprise to don't find any information concerning this point.
Thanks in advance, Best regards