1. What is major burnout cause issues in high wattage power AMP?. 2. How can select ESD damage parts before burnout during mass production line?. 3. Do we have any special function?.
Ans 1). The major cause issue is same time turn-on of high and low side internal H-bridge switching FET by some kind of damages during mass production stage(normally damaged by ESD).
Ans 2).TI power stage, TAS53xx series support power FET ESD damage part by some kind of protection functions that is leakage current check between power output node and gnd
Ans 3).If internal power FETs demaged by ESD or something else, the TAS53xx series can prevent burnout by leakage current checking function during first power on working stage.