LM4992SD DAP pad

Sevrum

I have the TI LM4992SD/NOPB in a new board development. I have a question on the DAP pad on the bottom of the part. Is this pad isolated from the part, or is it connected to ground or something else. The data sheet is a little unclear, the pad is used for heat sinking of the device. I’m just not sure if the pad is connected to anything in the device other than the package.

over 9 years ago

0 Diego Melendez over 9 years ago

TI__Guru 57800 points

Hi, Sevrum,

We will check this out and will get back to you as soon as possible.

Best Regards,

-Diego Meléndez López
Audio Applications Engineer

0 LeonardEllis over 9 years ago

TI__Guru 71526 points

As described on page 11 of the datasheet: " . . provide a low thermal resistance between the die and the PCB to which the part is mounted and soldered.", so the PAD is essentially connected to the substrate. The general rule is to connect the PAD to the most negative voltage on the device, in this case, GND. Page 12 defines the required vias under the PAD, and looking at the layout example on pages 16 and 17, these vias then tie into the very large GND pad on the bottom side of the pcb.

0 LeonardEllis over 9 years ago

TI__Guru 71526 points

Just checking to be sure this is resolved.

0 José Luis over 9 years ago in reply to LeonardEllis

TI__Mastermind 20085 points

Hi Leonard

Sorry for the delay. That is right, the pad should be connected to GND to make sure a correct power dissipation.

Best Regards
Jose Luis Figueroa
Audio Applications Engineer | A-Team

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LM4992SD DAP pad