• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 30 subscribers
  • Views 523 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLV320AIC23B: TLV320AIC23BRHD QFN thermal pad connection

Evan Shultz
Intellectual 285 points
Part Number: TLV320AIC23B

Page 42 of the datasheet (marked A-2) seems to indicate that the thermal pad can be connected to ground. But should it be AGND or DGND?

It also seems that leaving this pad open/floating is OK too.

But it's not clear to me and I don't see any other information about the thermal pad connection in the datasheet. Can someone clarify how this pad should be connected?

  • 0
    TI__Guru 57800 points

    Hi, Evan,

    The thermal pad in the TLV320AIC23B is not electrically connected internally to the chip, but it is recommended to connect it to the Analog ground (AGND) for thermal performance and rigidity of the device .

    Best Regards,

      -Diego Meléndez López
       Audio Applications Engineer