LME49724: Package footprint and size information

Dear Ivan,

Thank you for your reply.

I had download this file and see the diagram.

But I think the information is not clear.

Do you have the document such as the picture below??

Why only LME49724 not have this page in datasheet??

CK,

What is not clear in the bxl file?
The picture you shared is from D package, which does not have the pad below the IC. I think there was an update on the package information sheet for DDA package (LME49724) that it not showing the details as before. I'll check about that.

Best regards,
-Ivan Salazar
Applications Engineer - Low Power Audio & Actuators

Hi Ivan,

I know it's the D package. This's just an example.

Customers want a pdf file like this.

In the captured figure you showed, we don't know the power pad dimension below the chip.

Is it 60mil x 90mil ??

Thanks for your support.

Dear Ivan,
Thank you so much.