TAS5825M: The correctness of Delphi thermal model

Kazuki Kuramochi

Part Number: TAS5825M

Hello expert,

I have question for TAS5825M's Delphi thermal model.

I received thermal model in previous discussion on this E2E thread.
After provided this model to customer, They requested evidence of proofing the correctness of this model.
Would you provide such a data?(ex. comparison data between real device and thermal model)

I'm waiting for your reply

Best regards,
Kazuki Kuramochi

over 6 years ago

0 Alix Wan over 6 years ago

TI__Genius 9995 points

Hello customer,

Does your customer see any conflict between thermal simulation and practical test? If yes, can you share here?

Regards,

Alix Wan

0 Kazuki Kuramochi over 6 years ago in reply to Alix Wan

TI__Genius 10645 points

Hello Alix,

Thank you for your prompt reply.
My customer hasn't faced conflict between thermal simulation and practical test.
But they would like to confirm about correctness of thermal model beforehand.
Would you provide any material which explain about our thermal model's correctness?

Best regards,
Kazuki Kuramochi

0 Alix Wan over 6 years ago in reply to Kazuki Kuramochi

TI__Genius 9995 points

Hello customer,

I am sorry that currently we do not have the data for correlation after my internal check.

Regards,

Alix Wan.

0 Kazuki Kuramochi over 6 years ago in reply to Alix Wan

TI__Genius 10645 points

Hello Alix-san,

Well, Do you have comparison data between Real device thermal measurement and simulation data under same environment?

Best regards,
Kazuki Kuramochi

0 Alix Wan over 6 years ago in reply to Kazuki Kuramochi

TI__Genius 9995 points

Hello Kuramochi-san,

I am sorry as currently we do not have these comparison data on hand. But i will check whether thermal team can help on this case with specific schedule.

At the same time, i would recommend to apply a TAS5825 EVM board for your customer for experiment. Of course, the best choice is to test based on JEDEC standard 4-layer PCB.

Regards,

Alix Wan.

0 Kazuki Kuramochi over 6 years ago in reply to Alix Wan

TI__Genius 10645 points

Hello Alix-san,

I understand.

By the way, this question is from my curiosity, How do you made this thermal model?
I fell suspicion about why there was a model but no comparison data with the original. I guess this model was made from package thermal data, so you don't has comparison data between device and model. Is this correct?

Thank you and best regards,
Kazuki Kuramochi

0 Xiaolin Qin over 6 years ago in reply to Kazuki Kuramochi

TI__Expert 6295 points

hello Kazuki-san,

thermal models reflect various specific test cases and use conditions impact for thermal.it do not guarantee that the device will function in a customer system.

I attached you one example how we do comparing thermal model.

TAS5825M Thermal Simulation example .pdf

Regards

Linda

0 Xiaolin Qin over 6 years ago in reply to Kazuki Kuramochi

TI__Expert 6295 points

hello Kazuki-san,

thermal models reflect various specific test cases and use conditions impact for thermal.it do not guarantee that the device will function in a customer system.

I attached you one example how we do comparing thermal model.

3323.TAS5825M Thermal Simulation example .pdf

Regards

Linda

0 Kazuki Kuramochi over 6 years ago in reply to Xiaolin Qin

TI__Genius 10645 points

Hi Linda-san,

Sorry for may late reply.

As you for you attached document, is this explained about your modeled situation on left side table and simulated result on right side figure

Best regards,
Kazuki Kuramochi

0 Luis Fernandes de Pina over 6 years ago in reply to Kazuki Kuramochi

TI__Genius 15190 points

Hello Kuramochi-san,

Both sides of the table use the thermal model under different conditions to show how we use the model to compare the device behavior under different test conditions.

Best regards,

Luis

0 Kazuki Kuramochi over 6 years ago in reply to Luis Fernandes de Pina

TI__Genius 10645 points

Hello Linda-san,

So, Is this slide only has simulated data?
If it is correct we cannot prove the correctness of thermal model. However, fortunately, this slide has RθjA calculated by simulation data and I think we can prove the correctness by comparing calculated RθjA and RθjA on datasheet. So I would like to confirm about how to define RθjA on datasheet. Would you tell about this?

Best regards,
Kazuki Kuramochi

0 Matthew Miao over 6 years ago in reply to Kazuki Kuramochi

TI__Expert 6720 points

Hi Kazuki-san,

The datasheet RθjA is simulated based on EVM condition. This data is provided by thermal simulation team.

Regards,

Matthew

0 Kazuki Kuramochi over 6 years ago in reply to Matthew Miao

TI__Genius 10645 points

Hi Matthew-san,

I understood.
Well, Do you have any idea of proving our thermal models correctness?

And would you tell me about how to make thermal model?
If the other team made it, could you provide the contact person?

Best regards,
Kazuki Kuramochi

0 Matthew Miao over 6 years ago in reply to Kazuki Kuramochi

TI__Expert 6720 points

Hi Kazuki-san,

I will email you about how to contact thermal simulation team.

Regards,

Matthew

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TAS5825M: The correctness of Delphi thermal model