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TPA3255: Existence of alternate heatsinks other than the ATS-TI1OP-519-C1-R3 (heatsink used on TPA3255EVM) compatible with this device

Alec Mercer
Prodigy 50 points
Part Number: TPA3255


I was wondering if there might be any alternate "off-the-shelf" heatsinks which are compatible with the TPA3255 other than the ATS-TI1OP-519-C1-R3? I have an application which might benefit from a heatsink with a lower thermal resistance.

  • 0
    TI__Mastermind 28130 points

    Hi Alec,

    If there's a certain heatsink you have in mind then by all means you can try it. My only suggestion is to make sure it's able to handle the amount of heat that the device is outputting. 

    Best Regards,

    Robert Clifton

  • 0 in reply to Robert Clifton56
    Prodigy 50 points

    I do not have another heatsink in mind. So far, I have not identified any other heatsinks that are designed to mate-up with the HTSSOP 44-pin device package (the TPA3255's device package) other than the ATS-TI1OP-519-C1-R3. Would you or anyone know of any other heatsinks designed to mate-up with the HTSSOP 44-pin package?

  • 0 in reply to Alec Mercer
    TI__Mastermind 28130 points

    Hi Alec,

    Unfortunately I only know of the ones that we have made for our EVMs which are mostly made from similar material. If thermals are very important than I'd recommend taking a look also at what kind of thermal paste/grease you plan on using. A material with a higher thermal conductivity will help. 

    Best Regards,

    Robert Clifton