(DIsclaimer, not an EE.)
We were using a NXP Semi Class AB 1 Channel Amp (SA58631TK,118) now obsolete, that had a footprint of 8-HVSON.
We are looking at TPA6211A1DRB to replace.
Is this TI parts SON 3x3 package compatible with the existing 8-HVSON footprint without changing the board layout?
The logic appears to be the same except for the - and + output pins being switched.
Would appreciate anyone taking a quick look to compare to see if there are any other logic issues...
Thanks,
Eric
Hi, Eric,
Welcome to E2E and thank you for your interest in our products!
Unfortunately, the TPA6211A1 requires of a different footprint since the pitch is different from device to device. The TPA6211A1 has a pitch of 0.65mm (this results in 1.95mm from pin 1 to pin 4). The footprint of the 8-HVSON package requires a pitch of 0.5mm (which results in 1.5mm from pin 1 to pin 4).
NXP device package details:
https://www.nxp.com/docs/en/package-information/SOT908-1.pdf
TI package details:
http://www.ti.com/lit/ds/symlink/tpa6211a1.pdf#page=39
The equivalent package for this case would be the DRG package as shown below.
However, as shown in this product finder, there are only one audio device with this package (OPA1678IDRGR and OPA1678IDRGT).
Please let me know if you have additional questions or comments on this. We will be glad to help you.
Best regards,
Luis Fernando Rodríguez S.
