This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

OPA1632: Correct dimensions for DGN (PowerPAD VSSOP) package used with OPA1632DGN

Part Number: OPA1632

In the datasheet, there are two different sets of dimensions for the DGN (PowerPAD VSSOP) package, each with different thermal pad dimensions. As using the wrong size pad dimensions can cause assembly  failures going either way, it is critical that I know which drawing actually represents what we will be receiving when using this component. Please indicate which drawing represents current manufacturing so that we can correctly size the copper pads for this footprint. It's critical I know the answer within the next 24 hours, as the engineer who wants to incorporate this part in his design is waiting on the information to complete his design.

Robert Hart

  • Hello Robert,

    Unfortunately, either drawing may be received when ordering this part. The OPA1632 is made at two AT sites with different lead frames.  I would suggest designing your board with the smaller size thermal pad measurements so that it may work for either package.

    Best,

    Hasan Babiker