In the datasheet, there are two different sets of dimensions for the DGN (PowerPAD VSSOP) package, each with different thermal pad dimensions. As using the wrong size pad dimensions can cause assembly failures going either way, it is critical that I know which drawing actually represents what we will be receiving when using this component. Please indicate which drawing represents current manufacturing so that we can correctly size the copper pads for this footprint. It's critical I know the answer within the next 24 hours, as the engineer who wants to incorporate this part in his design is waiting on the information to complete his design.
Robert Hart