Hi Team,
TPA3116 manual recommends a heat sink:
The customer would like to know that when the heat sink is installed, something like silicone grease needs to be added between the chip and the heat sink?
If it is added, the PowerPad of the chip is insulated from the ground network, which does not reach the best grounding recommendations in the manual;
If there is no silicone grease, will the poor contact surface cause poor heat dissipation?
Thanks,
Annie
