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TAS5805M: PPC3 Dump to Header File: Active/Updated Components versus All Components

Juan Pablo Novo
Intellectual 875 points
Part Number: TAS5805M


Hi.

I would like some clarification about the header file generated by the dump process inside PCC3 needed to initialize TAS5805M.

Should I to dump each component even though I don't use it? Or could I dump only the active ones?

By now I am using the complete dump but as I only need the AGL/OTFB optional component, I would save a lot of memory in the MCU if I could use the partial dump.

Related to the AGL/OTFB component, I also would like to confirm with you that I must enable the AGL to make OTFB work, mustn't I? Even if I don't really need the basic AGL feature and I don't modify any of its default parameters (AGL Threshold = 0). Or is there any way to make OTFB work without enabling AGL?

  • 0
    TI__Genius 15200 points

    Hello Juan,

    It's highly recommended to use the script the the full dumped header file to do software initialization.

    In regards to the AGL/OTFB, the way the Thermal foldback works is that when the die temperature triggers the over-temperature warning (OTW) level (135C typ), an internal AGL (Automatic Gain Limiter) will reduce the digital gain automatically. The Thermal Foldback gain regulation speed (attack rate and release rate) settings are the same as a regular AGL.

    So there is no way to use the OTFB without the AGL, because it uses the AGL to limit the digital gain(and as of a result the output power) to reduce the temperature of the device.

    Best Regards,

    Luis

  • 0 in reply to Luis Fernandes de Pina
    Intellectual 875 points

    Thank you, Luis.

    Best regards,

    Juan Pablo Novo