This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TAS2764: package and PCB technology

Part Number: TAS2764
Other Parts Discussed in Thread: TAS2770, TAS2563, TAS2564


For the design of a audio amplifier I need to choose among TAS2764 and TAS2770 or any other you recommend.

Given the very small package of TAS2764, I need to better understand the technology required for the PCB. I have seen the balls of the BGA at 0.4mm pitch, and the pads of 0.2mm diameter.

Can you please send me the gerber files of the evalboard?

Or even the TAS2770 in QFN be more suitable?

It seems to me that it has the same functions (confirm?) But it is slightly more powerful and is much easier to mount.

Please let me know your thoughts and in case email me in private: a-faggio

Thank you,


  • Hello Antonio, 

    Our team will take a look at this thread and will provide a response as soon as possible.

    Best Regards, 

    Justin Beigel

  • Hi Antonio,

    TAS2770 and TAS2564 are what we all "external boost supply" devices, as opposed to other solutions like TAS2563 where the boost is integrated in the device.

    TAS2564 is newer and thus have some new features like Y-Bridge, which is improving the device efficiency considerably. However TAS2770 has higher supply voltage range capabilities, so if you need higher output power perhaps TAS2770 would be the option to go.

    Regarding package and layout, the small pitch of TAS2564 requires PCB fabrication and assembly technologies more sophisticated than TAS2770 in QFN.

    Please reach out through private message or email to share gerber files as needed. And also let us know if this solves your questions.

    Best regards,
    -Ivan Salazar
    Applications Engineer - Low Power Audio & Actuators