We’re doing a DPA on the TI parts listed below. Per MIL-STD-883, TM 2018, SEM is not required for planar die. Are the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?
5962L1423101VXC (ADS1282-RHA)
5962R1320202VXC (TPS7H1101A-R
5962-1620701VXC (CDCLVP111HFG-V)
Thanks,
