ADC09SJ800-Q1: FIT rate at Tj>105C

Yusuke Mukuno

Expert 7395 points

Part Number: ADC09SJ800-Q1

Hi expert,

My customer have a question about the following description in datasheet.

(1) Prolonged use above a junction temperature of 105°C may increase the device failure-in-time (FIT) rate.

How long time does the device have a risk of incresing FIT rate at Tj>105°C usecase?

Also, How about the value of increasing FIT rate?

Do you have any doccuemnt showing those data?

Thanks

Muk

over 1 year ago

0 jim s over 1 year ago

TI__Guru* 91947 points

Muk,

We are looking into this.

Regards,

Jim

0 Yusuke Mukuno over 1 year ago in reply to jim s

TI__Expert 7395 points

Hi Jim,

Do you have any update?

Thanks

0 jim s over 1 year ago in reply to Yusuke Mukuno

TI__Guru* 91947 points

Yusuke,

No, we do not have a specific value for the degradation above 105C. The limitation is the package, which has many different components and degradation mechanisms. In general if the time above 105C can be offset by more time below 105C, for example as discussed in the attached app note.

Regards,

Jim

sbaa403.pdf

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ADC09SJ800-Q1: FIT rate at Tj>105C