Hi expert,
My customer have a question about the following description in datasheet.
(1) Prolonged use above a junction temperature of 105°C may increase the device failure-in-time (FIT) rate.
How long time does the device have a risk of incresing FIT rate at Tj>105°C usecase?
Also, How about the value of increasing FIT rate?
Do you have any doccuemnt showing those data?
Thanks
Muk