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Hi there,
Does anyone could share their experience with AFE4500 solder ball crack impaction of PPG reading?
We have observe the below phenomenon during my failure analysis finding:
Low PPG DLP reading from the AFE4500 IC with half-cracked or non-spherical balls, the low DLP reading issue can be resolved when we reheat the AFE4500.
My Question is, does half-cracked or non-spherical balls impact the PD value?
BR,
Paul
Hello Paul,
Welcome to TI e2e forum!
Let us take this discussion offline since the device AFE4500 is shared under NDA.
I have sent you an email.
Hello Paul,
I shall close the post since we have take the conversation offline and have responded to your queries.