ADS8325: Ball composition

Kota Morihara

Intellectual 700 points

Part Number: ADS8325

Customers have asked the following questions to register their products. Can you give me more details?

Material: ADS8325IBDGKT,ADS8320EB/250,ADS8321EB/250,VCA821IDGST

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

Your prompt support would be highly appreciated, thank you!

over 2 years ago

0 Ryan Andrews over 2 years ago

TI__Guru 67096 points

Hello Morihara-san,

Thank you for your post.

This link has some useful guidelines for devices with BGA packages: https://www.ti.com/support-packaging/SMT-application-notes.html#bga

Regards,

Ryan

0 Kota Morihara over 2 years ago in reply to Ryan Andrews

Intellectual 700 points

Dear Andrews,

Thank you for your reply.
I saw the URL you gave me Information about Ball composition could not be confirmed.
Please let me know where I can find the information.

Best regards,

0 Ryan Andrews over 2 years ago in reply to Kota Morihara

TI__Guru 67096 points

Hello Morihara-san,

The ADS832x devices are not available in a BGA package. The only package options are VSON and VSSOP.

For more information about device package data, you can search the orderable product number on our Quality, reliability, and packaging data page:

https://www.ti.com/quality-reliability-packaging-download/report?opn=ADS8325IBDGKT

Regards,

Ryan

0 Kota Morihara over 2 years ago in reply to Ryan Andrews

Intellectual 700 points

Dear Andrews,

The 3 questions I asked were not listed on the package data page.

Please answer as you did when you inquired like the following URL in the past.
https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1189604/tps630250-ball-composition

Regards,

0 Kota Morihara over 2 years ago in reply to Kota Morihara

Intellectual 700 points

Dear Andrews,

Is Sn included in These materials?
If so,We would like to know following information.

1. Use Ni for grounding or not. : Yes / No
2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm
3. Heat treatment such as annealing or not : Yes / No

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ADS8325: Ball composition