Hi Expert,
May I clarify what's the purpose to design the stencil separating 25 windows by the vias? Or can customer just have a complete plan with vias?
Regards,
Allan
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Hi Allan,
The windowed stencil is more likely to have a uniform solder flow compared to a solid landing with vias. TI recommends using the windowed plan for this reason.
Thanks,
Erin
Allan,
Large apertures in the stencil also suffer from scoop-out, where the blade of the squeegee dips down into the void and 'scoops' some of the solder paste out.
The vast majority of stencil fabrication companies will automatically window-pane (that's what this technique is referred to) any large apertures even if you don't design them that way.
Ben