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ADS1298 question?

Other Parts Discussed in Thread: ADS1298

The following is my question?
Can ADS1298 which was mounted on PCB be done molding process again including ADS1298 pins? I know it will affect thermal radiation. Does this process influence ADS1298 operating temperature range? Does it degrade strongly ADS1298 performance?

  • Hi Yan Jia-hong,

    Placing your final ADS1298 assembly into mold compound will have an effect on its thermal radiation as you mentioned.  The absolute operating temperature range would remain the same though as everything is relative to the temperature gradient across the surface of the chip and the packaging.  The thermal properties of the mold compound would need to be taken into account, some thermally enhanced mold compounds could actually reduce the thermal resistance of the package.

    From the performance standpoint, I do not have any data to share with you.  I've not come across anyone encapsulating the ADS1298 in their system yet so I would be interested in seeing any test results you might have before and after.