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PTH04T240W: Part Information Request

Guelmary Fernandez
Prodigy 20 points
Part Number: PTH04T240W

Tool/software:

Hello,

I asked to TI about the minimum feature size of PTH04T240WAZ (see case CS2429751) because TI support personnel answered that the feature size is multiple. 

Can you provide the smaller value of the multiple values? 

Note: the minimum feature size is the Distance between the elements that make up the structures on a chip, commonly known as wafer node, tech node or feature size. The size of the features are measured in nanometers. A 22 nm process technology refers to features 22 nm or 0.022 µm in size. Also called a "technology node" and "process node," early chips were measured in micrometers.

Thanks

  • 0
    TI__Expert 5105 points

    Hi Guelmary,

    Apologies for the late answer. 

    I will get back to you until tomorrow latest.

    Thanks!

    Yann

  • 0 in reply to Yann Ducommun
    TI__Expert 5105 points

    Hi Guelmary,

    Apologies for late answer. This module is quite old and not very common, and I had to do some research.

    I confirmed that there are indeed multiple ICs, therefore multiple values for feature size, in the module. The issue is that some of those ICs are not TI devices. I'm missing feature size information on those ICs. Would it be enough if I provide the minimum feature size for the TI devices only?

    Thanks,

    Yann

  • 0 in reply to Yann Ducommun
    Prodigy 20 points

    Hello Yann, please provide all the minimum feature sizes that you can with the available info. Can you provide the type of ICs inside the module that are not part of TI? just to have an idea of what is inside too. 

    Also, how old is the module? Can you confirm at least when was the last design change? That info will help me too for my analysis. 

    Thanks a lot for this effort! 

  • 0 in reply to Guelmary Fernandez
    TI__Expert 5105 points

    Hi Guelmary,

    Here's what I could find out. The minimum feature size as far as I can tell is 150nm.

    Description Supplier Min Feature Size
    Switch Boost Converter Texas Instruments 500nm
    Synchronous Buck Controller Texas Instruments 720nm
    Operational amplifier Texas Instruments 1um
    Temperature Switch External Unknown
    Single Bus Buffer Gate Texas Instruments 150nm
    MOSFET External Unknown
    Bipolar Transistor External Unknown

    Regarding your second question, the device has been first released in 2006. The last (and, as far as I can tell, only) change is documented in a Product Change Notification PCN# 20100301000 from 2010 and concerns the qualification of an alternate source for Solder Ball Pin. No expected impact on Fit, Form, Function, Quality or Reliability regarding this change. I couldn't find any documentation regarding any other change for this device in our systems.

    I hope this helps!

    Yann

  • 0 in reply to Yann Ducommun
    TI__Expert 5105 points

    Hi Guelmary,

    Let me add that, in case you are considering a new design with this device, we have a much newer, and better performing, module in our portfolio:

    TPSM8287A12

    Feel free to check it out!

    Thanks

    Yann

  • 0 in reply to Yann Ducommun
    Prodigy 20 points

    Hi, 

    At the moment the component engineer does not have intention of changing the module. I will wait for the requested info :)

  • 0 in reply to Guelmary Fernandez
    TI__Expert 5105 points

    Hi Guelmary, 

    You may have missed my post above - I already provided the information you requested. Let me paste it again below, and sorry for the confusion:

    Here's what I could find out. The minimum feature size as far as I can tell is 150nm.

    Description Supplier Min Feature Size
    Switch Boost Converter Texas Instruments 500nm
    Synchronous Buck Controller Texas Instruments 720nm
    Operational amplifier Texas Instruments 1um
    Temperature Switch External Unknown
    Single Bus Buffer Gate Texas Instruments 150nm
    MOSFET External Unknown
    Bipolar Transistor External Unknown

    Regarding your second question, the device has been first released in 2006. The last (and, as far as I can tell, only) change is documented in a Product Change Notification PCN# 20100301000 from 2010 and concerns the qualification of an alternate source for Solder Ball Pin. No expected impact on Fit, Form, Function, Quality or Reliability regarding this change. I couldn't find any documentation regarding any other change for this device in our systems.

    I hope this helps!

    Yann