Original question:
Tool/software:
Hi team,
I think the pad would be used for the heat dissipation. If the pad is not connected electrically to GND, can this affect something in terms of electrical charactristics exept for thermal performance?
Regards,
Noriyuki Takahashi
Hello Noriyuki Takahashi,
The lid and heat pad are both connected to the GND leads of the package, so no direct connection to the heat pad is required for proper operation of the ADC. However, at higher data rates and power dissipation, you should use some kind of thermal heat sink to help maintain operating temperatures.
As an example, the EVM (now obsoleted due to software support) does not have anything connected to the heatsink or lid, and it was able to meet full datasheet performance.
Regards,
Keith Nicholas
Precision ADC Applications
