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ADC128S102QML-SP: Lead metal material

Paul Castillo
Prodigy 20 points
Part Number: ADC128S102QML-SP

Tool/software:

I have looked through the datasheet for the above part but cannot find the material of the metal beneath the soldermask. 

Would you please provide this information? I would like to be able to look up the thermal conductivity. 

Thank you. 

  • 0
    TI__Expert 4670 points

    Hi Paul,

    What is the specific orderable part number for the device in question? It will be any one from the "Part number" column from the picture below.

    Regards,
    Joel

  • 0 in reply to Joel Meraz
    Prodigy 20 points

    Hello Joel, 

    I was able to locate the appropriate sheet. Looking at it I see the following: 

    Is the lead frame where I would look to assess what material makes up the lead beneath the plating/soldermask? 

    Thank you. 

  • 0 in reply to Paul Castillo
    TI__Expert 4670 points

    Hi Paul,

    I'm not sure if soldermask would be the correct term for it, as that's usually used in reference to the layer on PCBs that prevent solder from adhering (in this case we want the opposite), but I believe you are looking at the correct table. The lead frame connects to the silicon chip via bond wires, and the lead frame is plated with conductive material that makes it easier to solder and for the bond wire to adhere to. The pins of an IC are part of the lead frame. 

    In this case, the lead frame is 58% iron and 42% nickel. 

    Thanks for the question!

    Regards,
    Joel