Tool/software:
Hi team,
For DAC53004, customer assembly process get a step to put it under 7.5MPa pressure for 2~3 minutes.
Could you help check if this is OK for DAC53004?
Regards,
Will
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
Hi team,
For DAC53004, customer assembly process get a step to put it under 7.5MPa pressure for 2~3 minutes.
Could you help check if this is OK for DAC53004?
Regards,
Will
Hi Will,
We do not have data on this, so I cannot give a definitive answer. We have a few packing app notes related to SMT placement that recommend minimal force during assembly. They mention using <3N of force on the SMT machine.
QFN and SON PCB Attachment (Rev. C)
Design Summary Multi-row Quad Flat No-lead (MRQFN)
Best,
Katlynne Jones