Tool/software:
Hello,
Regarding package outline RZH0030A, is it correct to assume that the solder paste shapes for pin 31 is centered about the solder mask defined pad for pin 31?
The current drawing indicates that the bottom of solder paste is 0.22mm away from the center line, and the bottom of the solder mask is 0.15mm away from the centerline which leaves a paste to mask offset of 0.07mm at the bottom of pin 31 but a 0.06mm offset at the top. Could this be rounding error and it should be a 0.065mm offset at the top and bottom?
Thank you!
