ADC12DJ5200RF: Environmental (Humidity, Shock, Vibration, Altitude) Qualification

Part Number: ADC12DJ5200RF

Tool/software:

Hello TI,

I'm interested in the TI ADC12DJ5200RF and would like to know what environmental qualifications the device has out-of-the-box. My application intends to place this component into a ruggedized enclosure; however, I would like to know what (if any) humidity, shock, vibration, and altitude qualifications the device has before incorporation into the enclosure. This helps me know what we may need to compensate further with when the device gets placed into its ruggedized enclosure.

I also see that the Enhanced Product (EP) version of the chip has a slightly higher temperature range and guaranteed logistics information. Are these the only differences between the base model and EP variant of the ADC? 

Thank you,

Joseph Blank

  • Hello Joseph,

    You can find the qualification summary for a given devices on the respective product page.  Click 'order now' then click 'View or download' under the 'Quality, reliability & packaging information' column for a given orderable part#.  Here is the ADC12DJ5200RF's https://www.ti.com/quality-reliability-packaging-download/report?opn=ADC12DJ5200RFAAV  

    TI does not perform humidity, shock, vibration, or altitude qualifications for our standard commercial-grade products. However, we did run in-situ thermal cycling on the ADC12DJ5200RF (and EP) -40C/125C and it does pass a min. of 1000cycles for each package configuration.  

    As you noted, the EP version does have a wider, guaranteed temperature range and is tested over-temp in production.  This version also has a SnPb die-bump compared to Pb-free on the commercial, so it is fully complaint to the DLA BOM requirements to be listed on a VID.  

    Hope this helps! 

  • Hello Kyle,

    Thank you for this information drop; it is very helpful! Does TI offer an alternative component with similar specifications that are tested under my aforementioned conditions?