Tool/software:
Hello TI,
I'm interested in the TI ADC12DJ5200RF and would like to know what environmental qualifications the device has out-of-the-box. My application intends to place this component into a ruggedized enclosure; however, I would like to know what (if any) humidity, shock, vibration, and altitude qualifications the device has before incorporation into the enclosure. This helps me know what we may need to compensate further with when the device gets placed into its ruggedized enclosure.
I also see that the Enhanced Product (EP) version of the chip has a slightly higher temperature range and guaranteed logistics information. Are these the only differences between the base model and EP variant of the ADC?
Thank you,
Joseph Blank