DAC7562: DAC7562SDSCR

Jordan Potter

Prodigy 10 points

Part Number: DAC7562

Tool/software:

Hi,

Could you please provide the Coefficient of Thermal Expansion for DAC7562SDSCR?

Many thanks,

Jordan Potter.

10 months ago

0 Paul_Frost 10 months ago

TI__Guru 56903 points

Hi Jordan, I will look into this. I will ask our quality department.

Thanks,

Paul

0 Paul_Frost 10 months ago in reply to Paul_Frost

TI__Guru 56903 points

Hi Jordan,

Is there a specific portion of the device which you are concerned about? Just the leads?

0 Jordan Potter 9 months ago

Prodigy 10 points

Hi Paul, apologies for the delay in my reply, could I please request the body/mold of the device? If there's anything on the leads that would be great as well, many thanks, Jordan Potter.

0 Paul_Frost 9 months ago in reply to Jordan Potter

TI__Guru 56903 points

Let me see what I can find.

0 Jordan Potter 8 months ago

Prodigy 10 points

Hi Paul,

Were you able to find any information?

Cheers,

Jordan.

+1 Paul_Frost 8 months ago in reply to Jordan Potter

TI__Guru 56903 points

Hi Jordan,

The device uses G770HDC mold compound, and the CTE is 7 PPM/C.

Thanks,

Paul

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DAC7562: DAC7562SDSCR