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ADS5474-SP: Inquiry about exposed PAD

JH Shin
Guru 11410 points
Part Number: ADS5474-SP


Tool/software:

Hello,

My customer has some questions about the ADS5474-SP exposed PAD.

Q1. Is gold plating a mandatory recommendation when designing a PCB for exposed PAD?

Q2. What is the recommended solder contact ratio between the exposed PAD and the PCB pad?

Thank you.

JH

  • 0
    TI__Mastermind 41350 points

    Hi JH,

    Q1. Is gold plating a mandatory recommendation when designing a PCB for exposed PAD? RR: no

    Q2. What is the recommended solder contact ratio between the exposed PAD and the PCB pad? RR: not sure I understand this question? Do you mean how much solder paste should be put down on the pcb for the device's exposed PAD to robustly connect?

    Regards,

    Rob

  • 0 in reply to Rob Reeder
    Guru 11410 points

    Hi Rob,

    Thank you for your reply.

    Rob Reeder said:
    RR: not sure I understand this question? Do you mean how much solder paste should be put down on the pcb for the device's exposed PAD to robustly connect?

    The customer asked what the recommended solder contact ratio is between the exposed pad of the ADS5474-SP and the PCB pad after SMT.

    Regards,

    JH

  • 0 in reply to JH Shin
    TI__Mastermind 41350 points

    Hi JH,

    I don't think we have specific data on the ratio. Its best to have adequate coverage across the entire epad to make sure there is a robust electrical and thermal connection between the pcb and device.

    Sorry, we just don't have a exact number.

    The only reason, I would assume the customer would ask, is if they are planning to change or modify the epad. So please advise against that, if so.

    Regards,

    Rob