Part Number: DAC7811
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Mask Set
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Die Revision
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Wafer diffusion lot
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Wafer fab process
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Mold compound
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Glass transition temperature (Tg)
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Die Dimensions
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Die Thickness
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Die Metallization material
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Die number of Layer
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Die passivation material(s)
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Wire Bond Material
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Wire Bond diameter
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Thank you in advance for your big support.
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Best regards.
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