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Need Land Pattern Recommendations for PCB layout for TS5A3154YZPR

John J Wu
Genius 3870 points
Other Parts Discussed in Thread: TS5A3154

The datasheet of  TS5A3154YZPR did not give any PCB layout guidelines for the specific package YZP 6. I checked http://www.ti.com/lit/ml/mxbg019h/mxbg019h.pdf per recommendation on the datasheet, and it shows the same as what's included in the datasheet. Please let me know if you have that available.

Thanks,

John

  • 0
    TI__Guru 71526 points

    Hi John,

      You are correct, the corresponding land pattern for the BGA is not shown, this is because for the BGA, the land paatern matches the defined ball pattern as shown on page 26 of the datasheet.  Unlike leaded devices, such as the DCU version of this device, the ball and pcb via must be identical.   If you scroll down the PF page, you'll see the CAD .bxl files.  These will provide the standardized pcb in CAD format; click on the Download link. 

    Additionally, MicroStar BGA Packing Guide: http://www-s.ti.com/sc/techlit/ssyz015.pdf has detailed info on land patterns for BGA, see page 10 for a start:

    CAD/CAE Symbols

    Part #
    Package | Pins
    CAD File (.bxl)
    STEP Model (.stp)
    TS5A3154
    • DSBGA (YZP) | 8
    Download
    -
  • 0 in reply to LeonardEllis
    TI__Genius 14317 points

    The attached document shows land pattern dimensions for WCSP packages including YZP 6. Also attached is a document on how to find land patterns for other packages.

    Package Land Patterns.zip