Sorry if this isn't the best forum - Hi-Rel seems to contain "Die/Wafer...
I am working on advanced RF applications, moving some existing designs to MMIC, flex PCB, and ultra-small integrations.
I have two designs using the CC1101, and would like to build a MMIC version using a CC1101 die (ribon bonds to substrate interconnect and other components).
I have some flexibility on the prototype demo so could use any of the Chipcon/CC family members (eg CC25xx or CC11xx), if that opens up die or wafer availability.
Please let me know what may be available, or if there are other RF components available in die or wafer; I have reviewed the datasheet on the TI die/wafer web page, but it was not very detailed about availability of RF components (http://proddownloads.vertmarkets.com/download/fdaf08b8/fdaf08b8-5439-4f27-9139-b0ac06eb3507/original/sgkb002.pdf ) and the contact links are dead.
Let me know if this is best discussed offline.
Thanks!
John