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DAC8832 Thermal Pad

Benone Radu
Prodigy 20 points

Other Parts Discussed in Thread: DAC8832

Hi everyone,

I have a question about this DAC8832 thermal pad as TI provided documentation doesn't seem to be consistent. Hopefully someone has used this DAC already and can shed some light.

I am reading in the datasheet (doc sbas380b) at page 5 that "Exposed pad must be connected to analog ground" (NOTE1 under the pin configuration). However, in the slau202a (EVM User's guide) this Thermal (Exposed) pad is not connected. Moreover, the Top Layer image on page 5 doesn't show a thermal pad at all, and traces are passing under the package. I am puzzled: What's with this thermal pad and how it should be connected?

Thanks!

Ben

  • 0
    TI__Mastermind 46290 points

    Hi Benone,

    In general a thermal pad doesn't absolutely have to be connected, but it is a best practice so the EVM really should have been implemented with the thermal pad connected to GND. 

    There are other GND connections in the package that should suffice to GND the device. The thermal pad does enhance performance by helping the thermal dissipation of the part. It is usually connected to the largest plane internal to the device such that heat can be transferred to the board GND outside of the package. Also, the thermal pad connection helps for reliability by enhancing mechanical stability.

  • 0 in reply to Kevin Duke
    Prodigy 20 points

    Thank you Kevin!

    BR