ADS1278IPAPT Land Pattern

EE_MT

Should I following the via pattern and thermal pad dimensions for the HTQFP-64 (PAP Package Drawing) that is on page 42 of the datasheet or the via pattern and thermal pad dimensions that is on page 50?

www.ti.com/.../ads1278.pdf

over 9 years ago

0 Ryan Andrews over 9 years ago

TI__Guru 66156 points

Hi Matt,

Please use the information on Page 50. These pages are automatically appended to our datasheets based on the device package. The thermal pad is actually 7mm x 7mm with a 1mm solder mask border as shown on page 50.

Regarding the vias, I realize there is a bigger discrepancy there between whether you need 9 vias or 36. You do have some flexibility there, depending on your layout constraints, but I would not use fewer than 9 vias.

Best Regards,

0 EE_MT over 9 years ago in reply to Ryan Andrews

Intellectual 390 points

Thanks.

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ADS1278IPAPT Land Pattern