Hi team,
A customer is trying to decide how to design their PCB pads for DSBGA parts. They have been looking through this app note, but are having trouble with some details due to the PCB technology available to them.
The comments on Page 6 (PCB Layout) under Table 4 (Recommended PCB Pad Geometry) are what they are struggling with. They need to use via-in-pad and that makes their pad diameter 0.31 mm. On a 0.4 pitch DSBGA they can't use a NSMD pad with via-in-pad and still maintain soldermask webbing between the pads. As a result their plan is to use a soldermask defined pad with their 0.31 mm via-in-pad stackup.
Are there any issues with this approach? Is there anything else to consider?
Regards,
Kareem