• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 46 subscribers
  • Views 490 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

ADS8568 QFN Package Thermal Pad

Peter Clerico
Intellectual 550 points
Other Parts Discussed in Thread: ADS8568

I can't find evidence that the package thermal pad is electrically connected to any internal signal - can you confirm this?

Also, I discovered the thermal pad is tied to AGND on the EVM for this part - is this the recommended layout?

Thanks for any advice.

  • 0
    TI__Guru 55466 points

    Hello Peter,

    Yes, you are correct, as you have mentioned, the ADS8568EVM layout shows the thermal pad connected to GND.  

    The ADS8568 QFN layout recommendation is to tie the Thermal pad to GND.  Figure 49 on the datasheet shows another layout example where the layout would use the thermal pad to tie AGND and DGND together at the thermal pad of the part through an exposed copper pad under the device, and the pad connects to the GND layer underneath through vias.

    Thanks and Regards,

    Luis