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DAC7822: Thermal Pad Connection

Ryan.Bishop
Expert 3900 points

Part Number: DAC7822

Hi,

The datasheet does not specify the connection of the exposed thermal pad. Is it N/C or ground, maybe neither? My gut tells me to connect it to the ground plane for thermal dissipation but I wanted confirmation.

Thank you,

Ryan

  • 0
    TI__Mastermind 46290 points

    Ryan,

    In general thermal pads should always be connected to the lowest / negative most potential used by the device, which in the case of a single-supply product that would be ground. Being that this is an MDAC and therefore basically just an R-2R ladder internally without any internal reference or output amplifiers the overall heat dissipation of the device is quite low so I wouldn't say that utilization of the thermal pad is required. From a mechanical stability perspective, however, I think it is always advisable to use the thermal pad, especially on modern thin QFN packages.

  • 0 in reply to Kevin Duke
    TI__Expert 3900 points
    Hi Kevin,

    Thanks for the quick reply! Since you recommended connecting this pad to the lowest potential (which might not be ground in a split supply application), would I be right to assume this pad is not internally connected to the device ground and is just a N/C?

    Thanks,
    Ryan