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ADS8318: Technical Query on ADS8318IBDGS

Part Number: ADS8318

Greetings,

We have Technical Query on ADS8318IBDGS. which is considered in one of our design and we need the data urgently to support the design requirement.

Query:
a. As per datasheet: Max Tj = 150°C & operating temp range (-40 to 85°C), Could you please confirm is it air temp, case temp or junction temp.?
b. Please do provide the reliability /qualification reports available for this part?
c. Power dissipation expected during the specification sheet test?
d. As per datasheet RθJA = 180°C/W, we would like to know the RθJC ?
e. If there are different temperature rating, are they all the same die design?
f. Any parameter information with greater 85°C?

Your quick reply in this regard will be highly appreciated.

Thanks

Siby

  • Answers:


    a.)  The operating Temp Range of -40C to 85C refers to ambient temperature.  Junction Temperature, Tj, has a specified max of 150C.

    b.)  Unfortunately, we do not normally provide the reliability and qualification reports for the suite of testing that we perform on each design.  However, the results are used to derive the Data Sheet Specifications.

    c.)  Power dissipation of the device is "typically" 18mW, with a max of 22.5mW at +Va = 5V and converting at the maximum sample rate of 500kHz.

    d.)  ThetaJC is not specified for this device (because heat sinks are not necessary), but ThetaJA = ThetaJC + ThetaCA can be used to give an idea of what is going on.  The temperature of the junction can be estimated by using the power dissipation formula:  Power = (Tj - Ta) / ThetaJA. 

    e.)  The MSOP (DGS) package and the SON (DRC) packages have different thermal characteristics.  Inside, the die is the same.  The SON package has a thermal pad on the bottom that gets soldered to your PCB, and therefore it dissipates heat more efficiently.  The SON package has a thermal impedance of 70 C/W, while the MSOP has a thermal impedance of 180 C/W.

    f.)  The datasheet for this device does not record characterization data taken outside the range of -40C to 85C.

    More information on our thermal specs can be found here: http://www.ti.com/lit/pdf/spra953 

  • Thank you

    -Siby
  • Hi Bryan,

    Please do send the reliability/ qualification reports once you have them.

    Thanks,
    Siby