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ADC128S102: MSL Peak Temp ,Lead/Ball Finish ,Pb-Free

oguzhan demirci
Intellectual 455 points

Part Number: ADC128S102

Hi,

can we get the values of MSL Peak Temp ,Lead/Ball Finish ,Pb-Free, for ADC128S102WGRQV and  ADC128S102WGMPR

thank you ,

ozi 

  • 0
    TI__Mastermind 29408 points
    Ozi ,

    I'll look into this and get back with you soon.

    best regards,
  • 0 in reply to Art Kay
    TI__Mastermind 29408 points

    Ozi,

    Regarding the "Lead/Ball Finish ,Pb-Free," part of the question:  Please use the following power point to get the documents from TI.com.  The procedure is relatively simple.  I will look into the "MSL" info and get back with you.

    best regards,

    3125.How to Find Reach and RoHS forms on TI.pptx

  • 0 in reply to Art Kay
    TI__Mastermind 29408 points

    Ozi,

    Below is the info on MSL:

    Device                                        Peak Reflow Temp                  Lead Finish                  Pb-Free

    =================              =================              ============            ======

    ADC128S102WGRQV             265C (ramp <= 5C/sec)              Tin/Lead (63/37)            No

    ADC128S102WGMPR             265C (ramp <= 5C/sec)              Tin/Lead (63/37)            No

     

    1. Reflow profiles are dependent on numerous factors including, but not limited to, solder type, flux, package type, number of components, board layers, board size, reflow oven type and accuracy as well as pre and post cleaning processes. Because of the number of variables it is not possible to provide a single reflow profile that is representative of every board using a specific package type. Typically manufacturing houses have reflow profiles in place and modify them for specific hardware.
    2. TI suggests using the flux manufacturer’s recommended profile as a starting point. In general ceramic parts are compatible with ramp-rates of less than or equal to 5°C/second with a maximum temperature of 265°C. Variations of course need to be comprehended based on time required to volatize the flux prior to the solder reaching liquid-state.
    3. Metal lid packages use a tin-gold solder preform to attach the lid. Tin-gold solder will begin to soften at 270°C and has a eutectic point of 280°C. Do not allow package body temperature to exceed 265°C at any time or permanent damage may result.
    4. Note that though-hole hermetic device specify a maximum temperature for soldering as a lead-temperature of 300°C for 10 seconds. This is not a reflow temperature.  See cautions above.

    Best Regards,

  • 0 in reply to Art Kay
    Intellectual 455 points

    Thank you Art

    best regards,