I have some question about ADS8568SRGCT(RGC Package 64-Pin VQFN).
Where should I connect the Exposed Thermal Pad of ADS 8556 SRGCT? Is it the AGND pin or the DGND pin of the ADS8556SRGCT? Or is it another pin of ADS8556SRGCT?
Kind regards,
Taka
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I have some question about ADS8568SRGCT(RGC Package 64-Pin VQFN).
Where should I connect the Exposed Thermal Pad of ADS 8556 SRGCT? Is it the AGND pin or the DGND pin of the ADS8556SRGCT? Or is it another pin of ADS8556SRGCT?
Kind regards,
Taka
Hello,
The external pad should be connected to the ground plane. It is recommended to have a separate solid ground layer.
If the application calls to partition this into analog and digital grounds, they must be kept at the same potential by using a low-impedance connection on the ADC analog and digital grounds near (or underneath) the device.
The ADS855x datasheet, in layout guidelines can give more detail
Regards,
Cynthia