ADC32RF45: Thermal design

Hiroshi Katsunaga

Mastermind 6480 points

Part Number: ADC32RF45

Hello,

My customer has a question about thermal design for ADC32RF45/80.

[Q]

Do you have some documents or gidelines for thrmal design of ADC32RF45/80 ?

They are going to use 4 DDCs and their sampling rate is around 2949.12MHz.

Therefore their estimated power dissipation is 7.07W(max).

Best Regards,

Hiroshi Katsunaga

over 8 years ago

0 Brian Kincaid over 8 years ago

TI__Intellectual 2750 points

Hiroshi,
I have sent this request to an engineer to check your estimate.
Regards,
Brian

0 Hiroshi Katsunaga over 8 years ago in reply to Brian Kincaid

Mastermind 6480 points

Hi Brian,

Thank you for your response.
OK, I will wait your additional information.

Best Regards,
Hiroshi Katsunaga

0 Sourabh Gupta over 8 years ago

TI__Intellectual 785 points

Hi,
You may refer to customer EVM layout. Majority of the heat flows through thermal pad. So you should consider using thermal vias. You may also consider adding a heat-sink below thermal pad footprint on bottom layer. ADC32RF45's customer EVM comes with a heat-sink attached under the device on bottom layer. Please look at it. You may also consider flowing more copper on top layer (may be 1oz) to reduce effective resistance from thermal pad to ambient air.
A useful appnote by TI is available here:
www.ti.com/.../spra953c.pdf
Regards,
Sourabh

0 Hiroshi Katsunaga over 8 years ago in reply to Sourabh Gupta

Mastermind 6480 points

Hi Sourabh,

Thank you for your response.

I have a question for your comments.
What is the customer EVM ?
Does it mean my customer board or your customer board or ADC32RF45EVM ?

Best Regards,
Hiroshi Katsunaga

0 Sourabh Gupta over 8 years ago in reply to Hiroshi Katsunaga

TI__Intellectual 785 points

Hi Hiroshi,
I meant ADC32RF45EVM.
Regards,
Sourabh

0 Hiroshi Katsunaga over 8 years ago in reply to Sourabh Gupta

Mastermind 6480 points

Hi Sourabh,

Thank you for your fast response.
OK, I understood your all comments.

Thank you for your cooperation.

Best Regards,
Hiroshi Katsunaga

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ADC32RF45: Thermal design