Part Number: ADC12D1600
Other Parts Discussed in Thread: ADC12D800RF, , , ADC12D1620QML-SP
Hello,
I am just wondering if anyone has tried to simulate the IBIS model of this component in ADS.
Thank you
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Part Number: ADC12D1600
Other Parts Discussed in Thread: ADC12D800RF, , , ADC12D1620QML-SP
Hello,
I am just wondering if anyone has tried to simulate the IBIS model of this component in ADS.
Thank you
Hi Jim,
At the moment, I am looking at a very standard/typical interface just to test performance parameters of this component at high Nyquist zones and also multiple component in time-interleave. I don't have yet a working ADS using IBIS model of this component as I don't know how to configure it in ADS. Thank you.
Regards
Hello Thai
The closest devices in feature set and functionality to the ADC12D1600QML-SP are the ADC12D1620QML-SP, ADC12D1600RF (similar to non-LSPSM mode in ADC12D16x0QML-SP) and ADC12D800RF (similar to LSPSM mode in ADC12D16x0QML-SP).
The ADC12D1600QML-SP and ADC12D1620QML-SP are space rated devices and are packaged in a ceramic column grid array package. The same IC die is used in both devices, but the ADC12D1620QML-SP has an improved package substrate design (connects the IC die to the package columns) to improve crosstalk and dynamic performance.
The ADC12D1600RF and ADC12D800RF use a thermally enhanced plastic BGA package.
Package parasitic differences between the various packages do result in differences in performance. Please refer to the product datasheets for each device to get a better understanding of those differences.
Best regards,
Jim B