ADC12D1800: Thermal icepak model for ADC12D1800CIUT/NOPB

Hi Girish

We don't have an icepak model available for this device.

I did locate a report with some additional modeling done with an earlier device that shares the same package and die size. It looks at Theta JA for the standard JEDEC thermal model condition (which is fairly pessimistic due to the small board size and low layer count) and compares that to more typical customer board types and heat-sink/airflow conditions. It may be somewhat helpful for your situation.

/cfs-file/__key/communityserver-discussions-components-files/73/0601.Thermal-Modeling-for-292L-TE_2D00_PBGA-nonNDA2.pdf

Best regards,

Jim B

Hi Girish

I checked with the model development team again.

Unfortunately the package used for this device is produced by a sub-contractor, and was designed for National Semiconductor prior to the merger with Texas Instruments. The detailed mechanical drawings needed to generate the icepak thermal model cannot be located, so the modeling cannot proceed.

Therefore the only thermal information we can provide is that already included in the ADC12D1800 datasheet.

Best regards,

Jim B