• State Resolved
  • Locked Locked
  • Replies 6 replies
  • Answers 1 answer
  • Subscribers 49 subscribers
  • Views 715 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

DAC38RF83: Part Difference

James Colotti
Prodigy 90 points

Part Number: DAC38RF83

Hi

What is the difference between the following parts?

XDAC38RF83 (67ZFEF9G1)

DAC38RF83I (6BZENL9G1)

Thanks,

Jim

  • 0
    TI__Expert 3505 points
    Hi James,

    The part number that begins with an X is considered a prototype product and it is certainly a preproduction device. Meaning it may have not been tested on the final test program and there is possibility that other changes were made in the final production device.

    Best,
    Mark
  • 0 in reply to high speed guy
    Prodigy 90 points
    Mark,

    Thanks - actually we were one of the early evaporators or the part - do you have anything more specific on the performance differences?

    Thanks,

    Jim
  • 0 in reply to James Colotti
    TI__Expert 3505 points

    Hi Jim,

    I understand. I will check to see if I can get some details on what may have changed. I am looking into the performance differences of the earlier prototypes versus production product and I will correlate that information with the prototype version you have inquired about.  


    Thanks,
    Mark

  • 0 in reply to high speed guy
    TI__Mastermind 18095 points
    Jim:

    As an early adopter, you may have initially evaluated the PG1 version of the silicon. PG2 silicon was released to market. The final version offered improvements in RF output bandwidth flatness and improvements to the CMP (clock mixing products). Also there was the addition of a div-by-2 on the clock output and synchronization feature added to the NCOs. Pin-out stays the same as does most of the programming.

    As noted before, the X designates prototype (i.e. prior to RTP). On PG2 silicon, there is no electrical difference between the X version and the production version. The production version went through full factory test while the prototype version was tested on the bench.

    --Russell
  • 0 in reply to RJ Hopper
    Prodigy 90 points
    Russell,

    This is good info - thanks - what is the difference between full factory test and the bench test - will the PG1 operate over temperature?

    Thanks,

    Jim
  • 0 in reply to James Colotti
    TI__Mastermind 18095 points
    No difference. The bench test is manual...the factory test is automated so it is faster.

    My records show your company received unit #611 around 6-28-16 (Requested by: TW; shipped to: MV); that is a PG2 silicon EVM so you are good to go to continue your evaluation.

    My records also show an older shipment around 9-28-15 with unit #007 that was provided via Jeff Coletti. This is a PG1 silicon EVM. If this is your current platform then I would recommend you to work with your local TI sales rep to get the latest EVM.

    --RJH