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MSC1210Y5: MSC1210Y5PAGT

Ken McGarvey
Prodigy 10 points
Part Number: MSC1210Y5

I am writing to inquire if the MSC1210Y5 has recently had any die changes or manufacturing relocation changes. In recent months we have seen an increasing number of failures related to temperature. History has shown us that die shrinks to semiconductor type components cause heat problems.

  • 0
    TI__Guru** 112725 points
    Hi Ken,

    Welcome to the E2E forum! There have been no die changes. The only changes that I see indicated was a mold compound/die attach change in May/2010 and a change in the moisture bag used in shipping April/2018. The moisture bag change is the most recent, and moisture could create an issue with reflow.

    The wafer is actually manufactured by TSMC and I do not have a way of determining if they have any changes in their manufacturing. If you suspect a quality issue, work with your purchasing distributor to initiate a failure analysis.

    Best regards,
    Bob B