Solder Joint Reliability acceleration Model

Yun FANG

Hello Lee McNally

Thanks a lot. That is what I want. And I would like to know whether you could share with me "Proc. SMTA, 2005, pp. 876-883"

Thanks a lot!

over 6 years ago

0 Lee McNally over 6 years ago

TI__Prodigy 460 points

Hi Yun, due to copyright reasons I am not able to repost the article here, but it is available from the SMTA website under the International Proceedings 2005. The article is named "AN ACCELERATION MODEL FOR Sn-Ag-Cu SOLDER JOINT RELIABILITY UNDER VARIOUS THERMAL CYCLE CONDITIONS" by N. Pan et al.

SMTA International 2005 Proceedings URL: https://www.smta.org/knowledge/proceedings_list.cfm?event_id=90

Best Regards,

Lee

0 Yun FANG over 6 years ago in reply to Lee McNally

Intellectual 310 points

Thanks a lot!

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Solder Joint Reliability acceleration Model