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DAC5675A: How to check the void rate under the DAC 5675A component ?

Anne Perhirin
Prodigy 30 points
Part Number: DAC5675A 
Hello , 
 
In our process assembly  we do not manage to check the void rate  under the  DAC5675AMHFG-V  with an X_ray inspection when the component is solder on the PCB.  Does TI have a procedure to check the void rate under this kind of package?

Does TI have some feedback regarding a glue process that can be applied  under the component ? If yes could TI tell us  the type of ( thermal + electric conductive) glue  that can be under the component ? 

Best Regards,