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ADS1282: Bare die information

Alex Baranov12
Prodigy 20 points
Part Number: ADS1282

I am looking for bare die information for ADS1282SKGDA. The datasheet doe snot outline that information. Do we have TI engineers here to who can provide that information?

  • 0
    TI__Genius 17125 points
    Hello Alex,
    Someone will reply to you on Monday when we are back in the office.
  • 0 in reply to Kirby Kruckmeyer96848
    TI__Genius 14540 points

    Fullscreen ADS1282AKGD_BONDPAD_COORDINATES.txt Download 
     DEVICE  = ADS1282
 UNITS   = MICRONS

 XORG    =     0.000
 YORG    =     0.000

 Die Size X UM       : 2494   UM                                              
 Die Size Y UM       : 3642   UM 

# Bond Pad Openings:
   1  1512.600    31.450  1588.600   107.450
   2  1827.600    31.450  1903.600   107.450
   3  2127.300    31.050  2203.300   107.050
   4  2310.600   214.350  2386.600   290.350
   5  2310.250   502.250  2386.250   578.250
   6  2310.250   910.050  2386.250   986.050
   7  2310.600  1199.150  2386.600  1275.150
   8  2310.600  1488.350  2386.600  1564.350
   9  2310.600  1776.350  2386.600  1852.350
  10  2310.250  2834.900  2386.250  2910.900
  11  2310.650  3233.700  2386.650  3309.700
  12  2084.300  3455.350  2160.300  3531.350
  13  1655.950  3467.600  1731.950  3543.600
  14  1386.050  3467.600  1462.050  3543.600
  15   715.950  3467.600   791.950  3543.600
  16   526.050  3467.600   602.050  3543.600
  17   356.050  3467.600   432.050  3543.600
  18   166.050  3467.600   242.050  3543.600
  19    25.700  2705.150   101.700  2781.150
  20    25.700  2609.600   101.700  2685.600
  21    25.700  2481.200   101.700  2557.200
  22    25.800  2329.100   101.800  2405.100
  23    19.200  2220.400    95.200  2296.400
  24    19.200  2110.400    95.200  2186.400
  25    31.450   927.500   107.450  1003.500
  26    31.450   630.500   107.450   706.500
  27    31.450   214.100   107.450   290.100
  28   190.300    31.350   266.300   107.350
  29   389.100    31.350   465.100   107.350
  30   503.400    31.350   579.400   107.350

# Bond Wire Assignments

ASSIGN 1=1
ASSIGN 2=2
ASSIGN 3=3
ASSIGN 4=4
ASSIGN 5=5
ASSIGN 6=6
ASSIGN 7=7
ASSIGN 8=8
ASSIGN 9=9
ASSIGN 10=10
ASSIGN 11=11
ASSIGN 12=12
ASSIGN 13=13
ASSIGN 14=14
ASSIGN 15=15
ASSIGN 16=16
ASSIGN 17=17
ASSIGN 18=18
ASSIGN 19=19
ASSIGN 20=19
ASSIGN 21=20
ASSIGN 22=20
ASSIGN 23=21
ASSIGN 24=22
ASSIGN 25=23
ASSIGN 26=24
ASSIGN 27=25
ASSIGN 28=26
ASSIGN 29=27
ASSIGN 30=28
    Hi Alex,

    This information is typically included in the datasheet of devices where KGD are available.  I have added this to our list of updates to this datasheet.  In the meantime, I have attached two files that provide information on the die.  The text file provides x,y coordinates of all bondpads internal to the device.  The .pdf file provides a picture of the bondpads in the mount and bond diagram of the ADS1282HPW device that uses the same die.    If this answers your question, please click Resolved My Issue button.

    ThanksADS1282HPW_MB_DIAGRAM1.pdf

    Christian