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LMP92066: About thermal pad

Masanori Tachibana
Genius 5350 points
Part Number: LMP92066

Hello support team,

I have a question regarding thermal pad of LMP92066.

Our customer wants to know the height value of the thermal pad .
On page 62 of the datasheet, there is a package drawing of the PWP0016A.
However, there is no information on the height from the seating plane (bottom of the lead) to the thermal pad.
Referring to Figure 18 of Application Note SLMA002H (www.ti.com/.../slma002h.pdf), I guess the thermal pad and mold surface of the package bottom are on the same surface.
But I could not find the description where the specific values were clearly stated regarding the height from the seating plane to the thermal pad, or the gap between the package bottom and the thermal pad.
Could you teach me the material that is described the concrete figures.

Sincerely,
M. Tachibana

  • 0
    TI__Mastermind 46290 points

    Hello,

    I have never known any mechanical package details to include height of the thermal pad in the description. Generally speaking it is flush, or nearly flush, with the package itself. Why is this information required?

  • 0 in reply to Kevin Duke
    Genius 5350 points

    Hello Duke-san,

    Thank you for your advice.
    It seems that our customer needs the information to create the drawings.
    He may be concerned about the solderability of the thermal pad.

    Sincerely,
    M. Tachibana

  • 0 in reply to Masanori Tachibana
    TI__Mastermind 46290 points

    Hello,

    I will do my best to see if I can get any firm validation on the topic, but as I said my belief is that they are at the same surface or level.

  • 0 in reply to Kevin Duke
    TI__Mastermind 46290 points

    Hello,

    I spoke with our Senior Packaging Engineer and can validate that the thermal pad and package bottom are at the same level, or extremely close to the same level.

    The only additional item he chose to point out was that this does not mean that the package bottom or thermal pad are touching the PCB plane when the device is placed on the PCB as the pin leads themselves do create some offset from the plane of the PCB.

  • 0 in reply to Kevin Duke
    Genius 5350 points

    Hello Duke-san,

    I really appreciate your kind support.
    I understood that the thermal pad was almost same level as the bottom of the package.
    I understand that there is a standoff on the package bottom of PWP0016A as well as the other power packages. So I believe that the solderability of the thermal pad of PWP0016A not a concern.

    Thank you very much.
    M. Tachibana