What is the minimum slew rate for the DI and SCLK lines over temperature, process and radiation?
Can this be derived from the 0.8MHz operating speed and the DC limits in the electrical characteristics alone?
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What is the minimum slew rate for the DI and SCLK lines over temperature, process and radiation?
Can this be derived from the 0.8MHz operating speed and the DC limits in the electrical characteristics alone?
Hi Steve,
I am not sure I understand the question or why "slew rate" would be a concern. What is important is to meet the timing requirements shown in section 6.8. Those limits are valid over temperature and radiation.
Kirby
Thanks Kirby - I'll figure out min rise time base don the duty cycle and 800kHz min operating.
In this application, I believe that the edges are being slowed to minimize EMI.
Steve, if rise and fall time are a significant part of the clock cycle, then you should be evaluating the time requirements based on Vil and Vih and not the full SCLK voltage swing.
Agreed!
I calculated ~ 30V/usec. This is similar to other guidance I have for SCLK/SDI interface and have recommended not going any slower than that rate.