LM12H458: Backward compatibility of CuSn lead finish of NOPB IC with SnPb process.

ANIKET SHUKLA

Part Number: LM12H458

LM12HCIV/NOPB finish is CuSn. Is this backward compatible with SnPb refolw process of LM12H458CIV ? If not so, please provide the reflow process.

over 5 years ago

0 PRAHLAD Supeda over 5 years ago

TI__Expert 6150 points

Team,

Appreciate your comments on above query.

0 Tom Hendrick over 5 years ago in reply to PRAHLAD Supeda

TI__Guru**** 180831 points

Sorry for the delay here, we are looking into the details.

0 Tom Hendrick over 5 years ago in reply to Tom Hendrick

TI__Guru**** 180831 points

Hi Aniket,

I have the following information from one of our process engineers:

LM12H458 is in a PLCC package, 44 pins, Matte Tin finish, MSL3-245. It is backward compatible with SnPb soldering process.

You can review TI Document number SNOA923 for details.

0 ANIKET SHUKLA over 5 years ago in reply to Tom Hendrick

Prodigy 155 points

Dear Tom,

Thank you for the reply. Kindly request you to confirm the Lead finish of LM12H458CIV/NOPB. The datasheet says it it SnCu. Is SnCu matte tin? If so please confirm. Else confirm whether SnCu lead finish is backward compatible or not?

0 Tom Hendrick over 5 years ago in reply to ANIKET SHUKLA

TI__Guru**** 180831 points

Hi Aniket,

The LM12H458CIV/NOPB lead-frame is copper (Cu), with an electroplated tin (Sn) finish. Here is another document that you might find useful:

http://www.ti.com/lit/an/szza035a/szza035a.pdf

Please do let us know if you have any additional questions.

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LM12H458: Backward compatibility of CuSn lead finish of NOPB IC with SnPb process.