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ADC12DJ5200RF: JESD Link Breaks Due to Heat?

Part Number: ADC12DJ5200RF

Hi,

I am using an ADC 12 DJ 5200 RF mounted on a board I designed.

I use Xilinx XCKU15P-2FFVA1156E and ADC connected by JESD204B.


When a board is incorporated into a machine and operated, the JESD link is repeatedly broken and reconnected in no time.
This did not occur when the cooling fan was blowing on the evaluation bench, so it appears to be a cooling issue.

However, the temperature of the chip does not reach 80°C and the room temperature is about 20°C when viewed with a thermo-camera even when the chip is in the machine, so there does not seem to be such a problem.
Since there is little room in the machine, could you give me some ideas on how to deal with it other than adding a cooling mechanism?

  • Hi,

    I would re-evaluate the timing budget analysis for the JESD link on the Xilinx part. If there isn't enough margin in the timing of the data capture, there could be issues like this when the heat rises on your system board.

    Other thoughts, would be to ensure a good ground plane for the ADC and Xilinx part, assuming they are on the same board and this is where most of the heat is coming from. Multiple ground layers would need to be used and some type of cross air flow is always desired.

    Lastly, you can try a putting a heat sink on both the Xilinx and ADC parts to add/help with better thermal flow outside the part.

    Regards,

    Rob

  • Thank you for an answer. It was helpful.

    I'll work with the mechanical design engineer to find out how to cool it.